Editors

• Didem Ozevin, University of Illinois at Chicago, USA
• Hossein Ataei, University of Illinois at Chicago, USA
• Mehdi Modares, Illinois Institute of Technology, USA
• Asli Pelin Gurgun, Yildiz Technical University, Turkey
• Siamak Yazdani, Heyer Engineering, USA
• Amarjit Singh, University of Hawaii at Manoa, USA

Editorial Board and Technical Committee

• Mohamed-Asem Abdul-Malak, American University of Beirut, Lebanon
• Syed Faiz Ahmad, Lievense Arabia Consulting Engineers, Saudi Arabia
• Baabak Ashuri, Georgia University of Technology, USA
• Svenn Borgersen, SEBCorp, USA
• Steffen Freitag, Ruhr University Bochum, Germany
• Sukru Guzey, Purdue University, USA
• Ghadir Haikal, Purdue University, USA
• Ruveyda Komurlu, Kocaeli University, Turkey
• David Kosnik, CTL Group, USA
• Mo Li, University of California Irvine, USA
• Eric M. Lui, Syracuse University, USA
• Mustafa Mahamid, University of Illinois at Chicago, USA
• Edward Minchin, The University of Florida, USA
• Mehmet Egemen Ozbek, Colorado State University, USA
• Eugenio Pellicer, Universitat Politècnica de València, Spain
• Víctor Yepes Piqueras, Universitat Politècnica de València, Spain
• M.V. Rama Rao, Vasavi College of Engineering, India
• Swapan Saha, Western Sydney University, Australia
• Joseph Schulenberg, University of Illinois at Chicago, USA
• Max Maher Shoura, Hill International, USA
• Vanissorn Vimonsatit, Curtin University, Australia
• Peter S. P. Wong, RMIT University, Australia
• Paul Ziehl, University of South Carolina, USA